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LDS8681
PIN DESCRIPTION
Pin #
1
2
3
4
5
6
Name
V IN
C1+
C1-
EN
LEDB
LEDA
Function
Charge pump input, connect to battery or supply
Flying capacitor 1 Positive terminal
Flying capacitor 1 Negative terminal
Device enable (active high)
LEDB cathode terminal
LEDA cathode terminal
7
8
PAD
GND
V OUT
PAD
Ground Reference
Charge pump output connected to the LED anodes
Connect to GND on the PCB
Top view: TDFN 8-lead 2 X 3 mm
PIN FUNCTION
V IN is the supply pin for the charge pump. A small
1 μ F ceramic bypass capacitor is required between
the V IN pin and ground near the device. The
operating input voltage range is from 2.7 V to 5.5 V. If
V IN falls below the under-voltage threshold, all LED
channels disable and the device enters shutdown
mode.
EN is the enable control logic input for all LED
channels. Guaranteed levels of logic high and logic
low are set at 1.4 V and 0.4 V respectively. To place
the device into zero current mode, the EN pin must
be held low for more than 50 ms.
V OUT is the charge pump output that is connected to
the LED anodes. A small 2.2 μ F ceramic bypass
capacitor is required between the V OUT pin and
ground near the device.
GND is the ground reference for the charge pump.
The pin must be connected to the ground plane on
the PCB.
C1+, C1- are connected to each side of the ceramic
flying capacitor C1 = 1 μF
LEDA, LEDB provides the internal regulated current
source for each of the LED cathodes. These pins
enter high-impedance zero current state whenever
the device is in shutdown mode. These pins may be
teed together to provide sum of the currents set at
every channel.
PAD is the exposed pad underneath the package.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane
? 2009 IXYS Corp.
Characteristics subject to change without notice
4
Doc. No. 8681_DS, Rev. N1.0
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